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CHIP-ON-LAMINATE
Chip on laminate in most cases is the
lowest cost packaging solution for circuit size reduction. Most circuitry
requiring less than 3 conductive layers with minimal power dissipation
requirements are ideal applications for this technology. HEI can integrate
chip & wire, flip chip, and surface mount devices, or combination of
these technologies to offer the best final circuit price and performance. |
Chip & wire interconnects
Flip chip IC integration
Multilayer laminate designs
Aluminum, gold and palladium bonding
Leading edge SMT to die design layout
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