Server: Netscape-FastTrack/2.0 Date: Thu, 20 Nov 1997 20:15:44 GMT Accept-ranges: bytes Last-modified: Mon, 11 Nov 1996 21:24:34 GMT Content-length: 2817 Content-type: text/html Electronic Systems Packaging (ESP)




Mission

Electronic Systems Packaging (ESP)'s mission is to establish Litton as an early involved and preferred strategic supplier of high speed systems and, by its product offerings, become the supplier of choice.

Overview

Electronic Systems Packaging (ESP) is the focused technical sales and marketing service of Litton's Advanced Circuitry, Inter-Pak Electronics, Winchester Electronics and Interconnect Products-UK.

ESP capitalizes on the collective strengths of our divisions to bring our customers the most reliable, cost effective printed circuit boards, custom backpanels, and enhanced interconnect system packaging in the industry.

Litton is the early involvement supplier to the world's leaders in communications, high speed computing, storage, network management, and the test/measurement markets. We focus on supporting the leading and emerging technologies in each of these markets -- including landmark work in fibre channel, switching, networking, and wireless technologies.

Electronic Systems Packaging offers simulation, modeling and verification, advanced signal analysis and testing, and competitive interconnect solutions for a balanced system package. With the recognized technical expertise of our applications engineers, we consistently demonstrate a shortened critical path in time to market and time to volume.

ESP's commitment to partnership with our customers has a significant impact on the engineering organizations of our valued customers. Collaborative engineering reduces development time, provides manufacturable designs, and through our advanced testing methods, measures actual product to provide simulation and modeling verification. Collaborative engineering provides our customers with the competitive edge of time to market by predicting the systems performance before layout begins. Verification testing of the signal integrity, digital and analog, provides a design that is right the first time, every time.


Capabilities

Digital Data Transfer




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