Index to Lecture 2

  1. Lecture 2 Outline
  2. VLSI Chips
  3. Other Factors
  4. Trends
  5. Fabrication Process
  6. Wafer Manufacturing
  7. Circuitry Processing
  8. Transistor at this Stage
  9. Additional Layers
  10. Finished Transistor
  11. Transistor Cross Section
  12. P-Channel Cross Section
  13. Two Types of Transistors
  14. NMOS Inverter
  15. Inverter Operation
  16. CMOS Inverter
  17. CMOS Inverter Operation
  18. Wafer Fabrication Notes
  19. Wafer Testing
  20. Dicing and Packaging
  21. Test and Burn-in
  22. Progress of Technology
  23. Transistors Shrink
  24. Chips Grow
  25. Wires Dominate Area
  26. Speed Increases
  27. Memory is Different
  28. Disk vs. RAM
  29. Cost Model
  30. Recurring Manufacturing Cost
  31. Approximate Wafer Costs
  32. Chips per Wafer
  33. Yield per Wafer
  34. Yield Values
  35. Cost of Testing
  36. Testing
  37. Packages
  38. System Cost
  39. Cost and Performance

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