Server: Netscape-FastTrack/2.0 Date: Thu, 20 Nov 1997 20:15:49 GMT Accept-ranges: bytes Last-modified: Mon, 11 Nov 1996 21:24:34 GMT Content-length: 5488 Content-type: text/html Litton: InterPak Electronics Inter-Pak Electronics


Mission


To be benchmark supplier of high-end packaging systems to our marketplace.

Overview

Inter-Pak Electronics is the world's leader in the assembly of high performance, complex, press-fit and surface mount backplane systems. We are the industry's benchmark with our innovative signal analysis, electrical test and automated assembly for repeatability, reliability and efficiency.

Inter-Pak is a proven supplier of multi-site, multi-national accounts. We are committed to ensuring our customers' success, and we meet that commitment with innovative solutions that are unsurpassed in our marketplace. We build the world's most robust systems, and stake our claim as THE market's performance leader. We continue to build our leadership position as one of the industry's largest and fastest growing companies.

The Industry's Benchmark in Test and Analysis
Inter-Pak Electronics is the world's leader in advanced signal analysis and electrical test capabilities. With the finest test equipment, we have firmly established our ability to manage all aspects of our customers' system testing requirements through Level IV and RF testing capabilities.
Our innovation and pioneering test record is especially important to our customers pushing the technology window in areas like fibre channel, RF, ATM, and high speed SCSIs.
Our test equipment has minimal size and grid restrictions and is designed for the leading-edge technologies. It provides the flexibility we need to react quickly to customer requirements while maintaining unsurpassed reliability for mission critical product.

The Industry's Benchmark in Solder Technology
Inter-Pak has more experience in successfully soldering high layer count, complex design, and/or large backplanes with high reliability than any other backpanel manufacturer. Solder processes have been a part of our assembly capabilities for many years, and we are aggressively developing our abilities to manage the next generation of technologies.
Our unique capability is with the use of advanced selective soldering systems in installing SMT devices in signal rich, very thick, or large backplanes.
Inter-Pak's surface mount capabilities include the installation, test and programming of PAL's, clocks, and clock drivers, E-PROMs, and EE-PROMs. We have the demonstrated ability to functionally test our customer's product.
Inter-Pak meets the industry's demands for ultrafine pitch SMT backpanels up to 24" in width. With solder stencil and dispenser, high speed placement and a forced convection oven reflow system.

The Industry's Benchmark in Press-Fit Automation
We continue to build our leadership position in press-fit automation. Our automation results in repeatability and consistency that is unsurpassed in the industry. No one has more experience or capability in building complex backplanes than Inter-Pak.
With our sophisticated automation, Inter-Pak leads the industry with the lowest labor content in the world, making us the most cost effective solution to system integration available.

The Industry's Benchmark in Chassis Integration
Inter-Pak has a decade of experience in providing value-added systems. We've progressed with our customer-partners leading the communications, computing, and storage industry from basic card cages to extensive chassis integration.

The Industry's Benchmark in Quality Systems
We continue to build our global leadership position with proven reliability and quality records that are unsurpassed for high performance press-fit, surface mount and hybrid backplane systems. Inter-Pak's ISO 9002 registered Quality System and our Customer Requirements Planning ensures that customer's expectations are satisfied from order placement through the life of the program.

The Industry's Benchmark in Materials Management
Engineered to maximize responsiveness to our world class customer's unique production needs by minimizing lead times and reducing component liability. Whether using a push system (MRP), or a pull system (Just in Time), Inter-Pak's experience with innovative materials systems satisfies unique manufacturing infrastructure needs around the world.



Process Capabilities

Test Capabilities

Major Equipment List

Digital Data Transfer


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